Details

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Ecofrec™ 205 No‑Clean Liquid Solder Flux

Ecofrec™ 205 is a solvent‑based, no‑clean liquid solder flux engineered to deliver exceptional wetting and soldering performance across a wide range of printed circuit board (PCB) finishes. Designed for both wave and selective soldering, this flux supports reliable results in lead‑free and traditional leaded assembly processes.

Key Features

• Solvent‑based, no‑clean flux – eliminates the need for post‑solder cleaning.

• Excellent wetting & through‑hole filling – great performance on Ni/Au, Sn, Ag, HAL, and OSP PCB finishes.

• Low micro‑balling and high solder integrity – minimizes defects for cleaner joints.

• High SIR (Surface Insulation Resistance) and passes BONO corrosion testing – boosts assembly reliability.

• Halide‑free & no halogen/CMR substances – safer handling without halides like fluoride, chloride or bromide.

• Colorless liquid with consistent composition and predictable process behavior.